heat sink Product List and Ranking from 16 Manufacturers, Suppliers and Companies | IPROS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. LSIクーラー Tokyo//others
  2. 富士商会 Tokyo//others
  3. 高木製作所 Ibaraki//others
  4. 4 ワイドワーク Tokyo//Trading company/Wholesale
  5. 4 null/null
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heat sink Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. [Case Study] Aluminum Extrusion Heat Sink 富士商会
  3. Heat sink for LGA1156/1155/1150/1151 ワイドワーク
  4. Heat sink, multipurpose, general-purpose F/H/M series LSIクーラー
  5. 4 Water-cooled heat sink for IGBT 高木製作所

heat sink Product List

1～30 item / All 46 items

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Copper water-cooled heat sink

Copper water-cooled heat sink

Immediate delivery is possible for in-stock items! We have a variety of standard products available, ranging from 20mm square to 1m in length, suitable for various applications.

We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. Since these are in stock, they can be delivered immediately, and we also sell peripheral equipment such as cooling water circulation systems. Additionally, we are open to inquiries about custom products. 【Features】 ■ Excellent cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery possible due to stock availability ■ Peripheral equipment such as cooling water circulation systems also available ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.

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Water-cooled heat sink for UV-LED

Water-cooled heat sink for UV-LED

Made of oxygen-free copper with excellent thermal conductivity and durability! In addition to 8 types of standard products, we can also manufacture various custom products according to your needs.

In recent years, the demand for UV-LED has significantly expanded. We would like to introduce the "water-cooled heat sink" that maximizes its performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. In addition to eight standard types compatible with various manufacturers' LEDs, we can also custom-make sizes up to approximately 500×800 millimeters. Upon request, we can perform processing such as tapping, notching, surface treatment, and helicoil installation. Please feel free to contact us. 【Features】 ■ Made of oxygen-free copper, excellent in thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to eight standard types, various custom products can be manufactured according to application ■ Socket types available include pipe, bamboo shoot type, PT thread, and nut fastening ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing the CPU's heat to dissipate quickly.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure that combines a copper base with stacked aluminum fins. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. The heatsink is a one-piece molded component made from machined aluminum ingots (material in block form).

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[Case Study] Optimization of Heat Sink Shape

[Case Study] Optimization of Heat Sink Shape

We will introduce a case study on the optimization of heat sink shapes, which is important for CPU heat dissipation measures!

We would like to introduce a case study where the "modeFRONTIER" was applied to optimize the shape of a heat sink. As a countermeasure to the heat generation problem of CPUs used in computers and other devices, it is very important to optimize the heat dissipation performance of heat sinks. With the multi-purpose optimization of "modeFRONTIER," it is possible to explicitly present a lineup of heat sinks with high heat dissipation performance that are suitable for the diversifying product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Countermeasure for CPU heat generation in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: By using multi-purpose optimization, a lineup of heat sinks with high heat dissipation performance suitable for diversifying product shapes was explicitly presented as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.

  • Company：IDAJ
  • Price：Other
  • Scientific Calculation and Simulation Software
  • Analysis and prediction system
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【Prototype Case of Sand Casting】HEAT SINK (Prototype)

【Prototype Case of Sand Casting】HEAT SINK (Prototype)

A successful case of casting a fin with a thickness of 1.25mm using gravity casting in die-casting prototyping!

We would like to introduce a prototype example of a "HEAT SINK." The product weight is 800g, and the dimensions are 280×110×55. We successfully cast a die-cast (mass production) prototype with a fin thickness of 1.25mm using gravity casting (self-weight). 【Overview】 ■ Material: AC4B-F ■ Delivery Industry: Automotive-related ■ Supported Lot Size: 1 to 100 pieces ■ Product Weight: 800g ■ Product Size: 280×110×55 *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink

Heat sink

Quickly transfers heat.

This is a radiator for electronic components that prevents the destruction of devices by quickly transferring and cooling heat. It mainly consists of a base plate to which the heat-generating element is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

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Heat sink for pin-mounted devices P/FP/U series

Heat sink for pin-mounted devices P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink designed for forced air cooling.

We are pursuing high performance in heat sinks and radiators. Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices with aluminum extrusion.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Since it is shaped using aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! It is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Comb Fit Heat Sink YK/YU/YX・YC Series

Comb Fit Heat Sink YK/YU/YX・YC Series

Achieving high-performance heat sinks with our unique aluminum pressure welding technology!

The comb-fit heat sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It features excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and intermediate fins → The number of intermediate fins can be changed to freely set the width of the fins (width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb-fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together under pressure, the metals bond, improving thermal conductivity between the base and fins → The stress generated during press-fitting and work hardening are combined to join the fins and base → The bonding strength is incomparable to simply pushing the fins into the base *Online meetings are also possible, so please feel free to contact us.

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[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

Support from thermal design to provide the right products! Free provision of analysis using simulation software and actual measurement data for thermal countermeasures!

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We aim to shorten development time and propose suitable costs. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also available, so please feel free to contact us.

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Thermal management in electronics! Optimal heat sinks for performance and cost.

Thermal management in electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be made freely according to specifications for each output capacity - Simple structure that does not require wind tunnel sheet metal - Both sides of devices such as power modules can be mounted 【YK Series/YU Series】 - Single-sided base type - Fin arrangement can be freely configured according to unit composition ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type - Selection from standard lineup, customization is also possible ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, customization is also possible ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages such as TO220 - Many standard lineup options available, dimension customization is also possible ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, designed for air cooling - Small-scale prototypes can be made, dimension and processing customization is also possible

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Crimp-type heat sink / comb fit

Crimp-type heat sink / comb fit

Heat sink compatible with high-output LEDs! Customization available according to application and structure.

As specialists in thermal radiation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural cooling heat fins as well as forced air cooling solutions. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Sink for Driver Circuits P Series" - Heat sinks with mounting terminals for TO-220 packages. - A wide range of standard lineups is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We offer heat fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fishing lights. *Online meetings are also possible, so please feel free to contact us.

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As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

Introducing examples of PIM utilization! We can mass-produce various shapes of heat dissipation products with excellent heat dissipation performance.

We would like to introduce a case study of PIM utilization by Atect Co., Ltd. As the CPU processing speeds of PCs and smartphones increase, the power generation has grown, necessitating high-precision components made from ceramic materials. Our company can manufacture excellent heat dissipation and insulation components using ceramics that have been thermally conductive through our unique technology, leveraging the high emissivity that ceramics inherently possess. These can be applied in various forms such as CPU heat sinks, fin-type heat sinks, pyramid-type heat sinks, pole-type heat sinks, and thin heat sinks. [Challenges Addressed] ■ Manufacturing of high-precision components using ceramic materials *For more details, please refer to the PDF document or feel free to contact us.

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[Technical Adoption Case] High Tongue Heat Sink Extruded Material

[Technical Adoption Case] High Tongue Heat Sink Extruded Material

By using performance analysis through simulation, we can provide proposals tailored to your needs!

We would like to introduce a case where our aluminum technology has been adopted for "high tong heat sink extruded shapes." Heat sinks are heat dissipation materials that utilize the high thermal conductivity of aluminum, used for cooling semiconductor devices in communication equipment and various control devices. The temperature rise of semiconductor devices can lead to issues such as reduced reliability, decreased performance, and destruction, making the use of heat exchangers essential. Aluminum heat sinks, which excel in cooling performance and cost, are utilized. Proposals tailored to your needs can be made through performance analysis using simulations. 【Case Overview】 ■ Application: Cooling of semiconductor devices in communication equipment and various control devices ■ Manufacturing Range - Outer diameter of extruded shapes (φ): 200mm or less - Tong support width (W): 3mm or more *For more details, please refer to the related links or feel free to contact us.

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Pin-type heat sink K type / Corrugated heat sink S type

Pin-type heat sink K type / Corrugated heat sink S type

Capable of accommodating special shapes! Standard heat sinks suitable for heat dissipation of electronic devices such as ICs and LSIs.

We would like to introduce the "heat sinks" that we handle. There are pin-type and corrugated-type heat sinks, both of which have excellent heat dissipation properties. The pin-type is available from a super compact size of 10mm square, while the corrugated type is particularly lightweight. These are standard heat sinks suitable for heat dissipation of electronic devices such as ICs and LSIs. Both types can accommodate special shapes, so please feel free to consult us. 【Features】 ■ Pin-type - Made of pure aluminum using special die casting - Generates a large heat dissipation effect relative to its size and weight ■ Corrugated-type - The fin parts on the corrugated surface are joined to the base part using a special method - Extremely lightweight due to being composed of thin plates *For more details, please refer to the PDF materials or feel free to contact us.

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Water-cooled heat sink for IGBT

Water-cooled heat sink for IGBT

Lightweight due to its thickness of 3 to 15 millimeters! You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models.

IGBT power devices used for various applications. We introduce the "water-cooled heat sink" that maximizes their performance. Made of copper, which excels in performance and durability, and lightweight due to its thickness of 3 to 15 millimeters. You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models. In addition to 8 standard products, custom manufacturing is available up to approximately 500×800 millimeters. The price is for one unit, with discounts available for orders of 2 or more, 10 or more, and 50 or more. For more details, please contact us. 【Features】 ■ Made of oxygen-free copper with excellent thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to 8 standard products, various custom products can be manufactured according to application ■ Three types (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from pure copper ingots (material in solid form) that has been machined (skyve processed) into a single molded shape.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from aluminum ingots (in a solid material state) that have been machined (skyve processed) into a single piece.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. Mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, airflow must be directed at the heatsink from an external source. It is often used in environments such as 1U rack-mounted servers equipped with blower fans or lined with small fans. The heatsink is a monolithic structure machined from aluminum ingots (raw material state).

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Fanless heatsink for Intel Socket LGA1700.

Fanless heatsink for Intel Socket LGA1700.

Total height 27mm, fanless heat sink cooler with copper core heat sink with heat pipe + aluminum fins.

It can cool CPUs for Intel Socket LGA1700. 【Features】 ● Fanless CPU cooler for Intel Socket LGA1700. ● A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used to efficiently transfer heat, allowing for quick dissipation of CPU heat. ● With a height of 27mm, it is slim and ideal for 1U rack mount cases, slim cases, and small cases where space is limited. ● This product is a fanless heatsink, so cooling performance is affected by the environment in which it is used. It is essential to direct airflow from an external source. Additionally, it does not guarantee cooling performance. ● The installation method uses a backplate, ensuring a secure fit and close contact with the CPU. There is also no worry of it falling, allowing for safe transportation.

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